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nThe first OSAT in the world to apply TSVs for CIS package in mass production

nThe only OSAT in China can provide CIS product turn-key services from chip package to module

nThe only OSAT in China have the mass production capability for both Bumping and TSV .

 

Established in June 2008, Huatian Technology (Kunshan) Electronics Co., Ltd. is a corporation specializing in advanced LSI (Large-Scale integration) assembly and test. We are located in Kunshan City of Jiangsu Province, which has a rich cultural history and beautiful scenery, just a 30-minutes drive away from Shanghai Hongqiao International Airport. We provide the services including Image Sensor Chip & Module packaging and test, Fingerprint Sensor Chip & and Module packaging and test, WL-MEMS Sensor Chip packaging and test, Wafer Bumping, WL-CSP, Flip Chip, low cost solution to Fan-out, and 3D multi-chip stacked package development.

 

Covering an area of 7,2000 square meters, we now have over 270 engineers, as well as a total of 1026 sets of process equipment and instruments, including Photo Etching, PVD, PECVD, Dry Etching, Electroplating, Electroless Plating, Wet Etching, Grinding, Dicing, Taping, Optical Deposition, etc. We have the capabilities of electrical, thermal & mechanical simulation, reliability testing and analysis. We have applied for 108 patents, 10 of which have been granted.

 

    We uphold the open and win-win mentality to build partnerships with customers worldwide.

The cooperation modes include:

nProviding customers with one-stop turnkey assembling and testing services

nProviding customers with partial process services

nConducting joint development of new technologies with customers.

 

 

90 mins to Shanghai Pudong International Airport

45 mins to Shanghai Hongqiao International Airport

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