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Honor

In Nov. 2013, “R&D and Industrialization of TSV in the Packaging of Image Sensing Chips” project was awarded “Great Scientific & Technological Achievements Transformation” project by Ministry of Science and Technology;
In Sep. 2013, the company was awarded “Credible & Law-abiding Advanced Enterprise”;
In 2012, the company was awarded “Jiangsu TSV 3D Packaging Engineering & Technological Research Center”;
In 2011, the company established “CSG Huatian Xitai Advanced Packaging United Laboratory” together with Chinese Academy of Sciences;
In Nov. 2011, the company was awarded “Suzhou Enterprise Technology Center”;
In Aug. 2011, the company was awarded “Labor Relation Harmonious Enterprise”;
In 2011, the company was awarded “Top-ten Large-scale Enterprise in the Industry”;
In 2010, the company was awarded “TSV 3D Packaging Engineering & Technological Research Center”;
In 2010, the company was awarded “Jiangsu High-tech Enterprise”.

 

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