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WLP Service

Category Description :

Wafer Level Package (WLP) is generally defined to directly carry out most or complete packages and tests on wafers and then carry out singulation to form single components. Moreover, technologies such as RDL, bumping, copper pillar and TSV are key technologies of WLP.
Huatian (Kunshan) Co., Ltd. has rich experience in WLP, and particularly has advanced mature TSV technology and firstly realizes TSV mass production worldwide. It can provide customers with Turnkey service integrating design, OEM and test.
Our WLP technology has the following advantages:
1. Low cost;
2. High yield;
3. High reliability;
4. High properties;
5. High chip area utilization rate.


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