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TSV

Category Description :

TSV (Through-Silicon-Via) is the latest technology for providing vertical conduction between two chips as well as between two wafers to connect chips with each other. Different from the traditional IC packaging bonding and salient point superposition technologies, TSV can ensure that chips have the highest stacking density and the smallest dimension in the 3D direction, and greatly increase the speed of chips and the performance of low power consumption. TSV is a key technology for 2.5D and 3D packaging.
Kunshan Branch of Huatian Technology can provide mature mass production TSV processes including a TSV process with the depth-to-diameter ratio of 1:1 and a TSV process with the depth-to-diameter ratio of 3:1.

 
The technology can provide customers with the following advantages:
1. Low cost;
2. High yield;
3. High reliability;
4. Reducing the chip size;
The main process has the following procedures:

Main parameter index:

Via Type

Wafer size

Via Diameter

Via Depth

Via angle

Metal

Resistence

Reliability

1:1

200mm

60um

60um

65°

Al/Ni/Au

Solder mask

MSL3

3:1

200mm

30um

100um

90°

Cu/Ni/Au

Polymer or PECVD

MSL1

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