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Test Service offerings

Category Description :

Our test could support Wafer level , chip level and module level test, including Package Signal Integrity Analysis, Failure Analysis, Qualification Testing, Wafer Inspection which are listed below. Additionally, we could provide customized test service, such as customized test vehicle and customized probe test etc.

  •  Wafer Probe Test 
  •   Finial Test(include Electrical 、Function 、 Performance rank)
  •   Module Test
  •   HAST-High Accelerated Stress Test
  •   Temp storage Test
  •   Thermal shot Test
  •   TMCL-Temperature Cycle Test
  •   Grinding and Cross-section analysis
  •   SEM-Scanning Electron Microscope 
  •   Auto view inspection
  •   X-ray inspection analysis
     

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