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The company has a set of advanced 8-inch WLCSP mass production technical line and strong process capability, and is equipped with imported semiconductor manufacturing equipment and semiconductor packaging equipment. The semiconductor manufacturing equipment includes vacuum thin film deposition equipment, a plasma etching machine, photoetching equipment, cleaning equipment, electrochemical plating equipment, a laser drilling machine and a laser cutting machine, and the packaging equipment includes aligning and bonding equipment, thinning equipment, mechanical cutting equipment, printing and reflow soldering equipment, laser marking equipment, chip check and release equipment, sample experiment and SEM analysis equipment during reliability testing, and so on.


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