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RDL

Category Description :

RDL (Redistribution Layer) evidently means rewiring. By a rewiring technology, welding pads can be rearranged at any position of chips. The technology has the advantages that systems and packages can he more flexibly designed through this change. By the rewiring technology, the speed of clock signals can be changed, and the distance between two salient points can be expanded. Currently, the technology is mainly applied to power managers, image sensors, pressure sensing elements, high-frequency inductance elements, etc.

 
Process ability is ready

Wafer size

Line & Space

Metal(THK)

Layer num

200mm

20um/20um

Al/Ni/Au(10um) or Cu/Ni/Au(MIN:4um)

1

Process ability to be ready


Wafer size

Line & Space

Metal(THK)

Layer num

200mm&300mm

10um/10um

2um<Al<6um
2um<Cu<20um
1um<Ni<3um
0.03um<Au<0.1um

2

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