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Solder Bumping

Category Description :

Bumping means placing solder balls onto chip welding pads by a chemical plating or electroplating technology and a stencil printing or flip chip bumping technology. Chips can be directly welded on circuit boards in an inverted mode to finish the assembly and mutual connection between the chips and the circuit boards. By the technology, the size of chips can be substantially reduced, and the signal communication capacity and heat dissipation capacity can be substantially improved in terms of function; and the technology features high density I/O, low packaging cost, etc. The technology can be applied to packaging of chips of DSP, BP, RF, memory, etc.

Current process capability:


Wafer size

Method

Bump diameter

Bump height

Bump pitch

Bump Metal

200mm

Mount

150um

100um

300um

As customer request
(MP SAC305)

200mm

Print

200um

100um

400um

Research and development capability:


Wafer size

Method

Bump diameter

Bump height

Bump pitch

Due date

300mm

Mount

150um

100um

300um

2014

300mm

Print

200um

100um

400um

200mm&300mm

Plating

100um

100um

200um

2014

WLP

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