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WLC Service

Category Description :

WLC (Wafer Level Camera) module is subjected to mass production by a wafer bonding process on the basis of CSP (Chip Scale Package) of CIS (CMOS Image Sensor) and WLO (Wafer Level Optics) technology, is the development direction of camera module standardization, represents the most advanced camera module manufacturing technology, features high temperature resistance, small size, small height and so on, is particularly suitable for ultrathin products, can realize an ultra-small high-resolution module by a multi-lens stacking technology and is the direction of camera module standardization in the future.
Huatian (Kunshan) Company has rich research, development and production experience in the aspect of WLC, and can provide customers with one-stop services of design, production and testing.


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